HAOYING LV1225A Single-Chip Dual-Band Imaging Module

Model: HAOYING LV1225A
LWIR 8–14 μm + Visible 0.4–0.9 μm

High-resolution dual-band module. Up to 1280×1024 LWIR + 2560×1440 visible. CML or MIPI. 35×35mm, DC 5V. Two detector configuration options.

IR Spectral Band Long-wave IR (LWIR): 8–14 μm
IR Pixel Size 12 μm
Visible Pixel Size 2.5 μm
Config Option 1 IR 1080×1024 + VIS 2560×1920
Config Option 2 IR 1280×1024 + VIS 2560×1440
Video Interface CML / MIPI
Communication Interface RS422
Power Supply DC 5V
Dimensions 35×35 mm
Compatible Lenses Fixed-focus athermalized, Continuous zoom, Motorized focus, Dual FOV

The HAOYING LV1225A is the high-resolution flagship of the single-chip dual-band series, offering up to 1280×1024 LWIR combined with 2560×1440 visible light from a single 35×35 mm module. Two detector configurations allow optimization for either infrared or visible resolution priority, with CML or MIPI interface selection.

Configuration Options

Option 1 — Visible Priority:

  • IR: 1080×1024 @ 12 μm
  • Visible: 2560×1920 (approximately 5 MP)

Option 2 — IR Priority:

  • IR: 1280×1024 @ 12 μm (maximum IR resolution)
  • Visible: 2560×1440 (QHD)

Both configurations available with CML or MIPI video interface.

Key Features

  • Highest IR resolution single-chip dual-band — 1280×1024 LWIR option
  • Two configuration variants — optimize for IR or visible resolution
  • CML or MIPI — flexibility for SoC and FPGA platforms
  • 35×35 mm — standard compact board format
  • DC 5V — portable and UAV power compatible

Typical Applications

Professional UAV dual-band payloads, advanced EO/IR handheld systems, airborne reconnaissance pods requiring high-resolution dual-channel imagery, and next-generation compact multi-band turret cores.

HAOYING LV1225A Single-Chip Dual-Band Imaging Module Specifications

Interested in HAOYING LV1225A?

Contact our engineering team to discuss integration requirements, custom configurations, and volume pricing.